Innovative sensors for the study of crops and soil health, targeting applications for Climate-Smart Agriculture. Different types of sensors: electrical, physical, (bio)chemical. Devices going beyond the SoA for possible improvements in terms of efficiency, robustness, low-cost, low-power.
In the rapidly evolving landscape of sensory technology, the integration of printed smart sensors into electro-skin (e-skin) represents a frontier with transformative potential across numerous domains, including medical diagnostics, soft robotics, intelligent prosthetics, and enhanced human-computer interaction.
In-situ acoustics piezoelectric sensors development and sensing technologies for diverse industrial and non-industrial settings with a focus on difficult and challenging conditions, such as high pressure, high temperature, corrosives, radiation, and more
Bio-digital convergence technology is essentially the integration of biotechnology and digital technology. The merging of these technologies also together with nanotechnology can create innovative new technologies. It is a rapidly evolving field that holds great promise for a wide range of applications including the sensor system. Biotechnology provides the sensor with excellent sensing elements, which allows an extremely selective and sensitive interaction with specific target molecules. Then these elaborative binding events affect the electrical properties of the transistor, resulting in a high discrimination ability. Nanotechnology provides the transistor with excellent electrical properties, which allows the development of new and improved electrical sensing platforms, which can be also assembled as an array and used for multiplexed detection. Digital technology contributes to the signal processing and pattern analysis in the sensor system. This focused session will cover the newly developed sophisticated bio-digital convergence technology for a sensor system.
Over the past decade, 3-dimensional (3D) wafer level stacked backside Illuminated (BSI) CMOS image sensors (CIS) have achieved the rapid progress in mass production. This focus session on stacking in image sensors will have 4 invited papers to explore the sensor stack technology evolution from process development, circuit architecture to AI/edge computing in system integration.
The paper from Daniel McGrath, TechInsights “The Productization of Stacking in Image Sensors” introduces the critical process flow of stacking tech to optimize the sensor performance with advanced logic process. Reverse engineering results are used to explore the development of stacked image sensor technology.
